BUSINESS SCENE

The machine that is used in back-end semiconductor manufacturing is a die bonder. What we handle is the packaging of individual semiconductors for one specific function, called discrete devices. These are customized devices made according to various specifications under built-to-order manufacturing.

Discrete semiconductors widely used in everyday home appliances and IT equipment have various specification and condition requirements depending on their application. The items being made change, so the technology changes too. What is required is truly customized manufacturing.

Without connections with manufacturers with broad knowledge and experience in core die bonding technology who will undertake collaborative development, it is impossible to develop and deliver devices that meet client orders. Factors such as speed, accuracy, cost and delivery deadlines are naturally important. E-Globaledge has already sold in excess of 2000 die bonding units which are now operating locally and overseas.

Advances in semiconductor technology are moving at a pace so rapid it can be described in terms of minutes rather than days. Mobile telephones and home appliance products have also become astonishingly smaller and more energy-efficient compared to a decade ago. This is achieved by making electronic components smaller and lighter, and enhancing performance.