Manufacturing and inspection equipment

Texus fully automatic epoxy die bonder [EBD4600S]

Manufacturing and inspection equipment

Texus fully automatic epoxy die bonder [EBD4600S]

Fully automatic epoxy
EBD4600S

[Texus]
Discrete
PKG die bonder

Texus fully automatic epoxy die bonder [EBD4600S]
ItemSpecifications
Bonding system Epoxy or eutectic system, DAF
Chip size Min.□0.2mm-Max.□3.0mm
Bonding precision XY = ±35μm(1.5mils), 3sigma
Bonding load 0.3N-1.2N(5N)
Supported work Strip plastic lead frame, carrier tape
Lead frame width/length Width : -60 mm
Wafer size Length: 150 – 260 mm
Supporting up to f8‘’
Machine cycle time 0.35 sec/chip (epoxy dotting)
0.25 sec/chip (eutectic)
Transfer system Feed pin system or gripper transfer system (exclusive to epoxy)
Loader Multi-magazine (standard) / Adsorption stacker
Unloader Multi-magazine
External dimensions 2,200(W) x 1,250(D) x 1,880(H)mm
Weight Approx. 1,000 kg
Necessary equipment Power supply : 200 – 240 VAC±5%, 50/60 Hz
Max. 25 A (5 kVA) Main power supply : 10 A, Heater power: 15 A
Vacuum source: -73.3 kPa or more
N2 gas: 0.4 MPa or more
Air: 0.2 MPa or more
Options
  • High-precision bonding using a vacuum clamp and the rear side recognition function
  • Flat spring bond head to minimize shock load
  • New-type rotary bond head enabling θ control
  • Helps reduce production losses via post bond recognition and wafer map support

Other Custom equipment products

  • Texus fully automatic solder die bonder [DBD3570S]
    English 中文
  • Texus fully automatic epoxy die bonder [EBD4350S]
    English 中文
  • Texus fully automatic epoxy die bonder [EBD4600S]
    English 中文
  • Texus fully automatic flexible epoxy die bonder [DBD4200R]
    English 中文
  • Sanyo Seiko high temperature observation equipment [SK-5000]
    English 中文

For inquiries about Semiconductor manufacturing systems and relational materials

For inquiries about our products and business negotiations

Contact by form

Contact by phone

+81-(0)3-6412-6034