Manufacturing and inspection equipment
Texus fully automatic solder die bonder [DBD3570S]
Manufacturing and inspection equipment
Texus fully automatic solder die bonder [DBD3570S]
Fully automatic solder die bonder
DBD3570S
![Texus fully automatic solder die bonder [DBD3570S]](https://www.e-globaledge.com/wp-content/uploads/2020/03/photo_dbd3570s_01_l-e1585016209648.jpg)
| Item | Specifications | |
|---|---|---|
| Bonding Method | Solder | |
| Chip Size | □1.0mm-□6.0mm | |
| Bonding Accuracy | XY = ±50μm, Θ±3° (Depends on chip size) |
|
| Bonding Weight | 80gf~200gf (Digital setting) |
|
| Leadframe | Strip type leadframe D-PAK, TO-126, TO-202, TO-220, TO-3P |
|
| Leadframe Length/Width | Length : 150mm~250mm Width : 15mm-70mm |
|
| Wefer Size | Wafer ring outer dia : 8" | |
| Machine Cycle Time | 0.6sec./chip (depend on bonding condition) | |
| Index Method | Pin Indexing | |
| Loader | Vacuum stacker / Magazine stacker | |
| Unloader | Magazine stacker (8 Magazines) | |
| Dimensione | 1,900(W) x 1,245(D) x 1,680(H)mm Excludes signel tower | |
| Weight | 1,200kg (approx.) | |
| utilites | Power : AC100-200V±10% ,50/60Hz Vacuum ; -0.07Mpa Over N2 Gas ; 0.2Mpa Over Forming gas : 0.2Mpa Over Air ; 0.5Mpa Over |
|
| Operation | Windows NT Touch-screen |
|
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