Systems for High-Intensity LEDs

Material/substrate process

Double-sided lapping/polishing machine

Doubled-sided lapping and polishing machine handling 2" to 6" sapphire wafers.

LED wafer process

High-speed film thickness / PL measuring instrument

LED chip process

Fully automatic laser processing machine achieving high productivity

With a mini-sized integrating sphere, data correlation has improved greatly, achieving high-precision sorting.

LED package process

fully automatic high-speed die bonder for high-intensity LED PKGs